DLTech Thermal Pad 90 × 50 × 3.0 mm 15W/mK

DLTech Thermal Pad 90 × 50 × 3.0 mm 15W/mK
The DLTECH thermal pad transfers heat between a component and a heatsink. It offers a thermal conductivity of 15W/mK, which supports efficient heat dissipation. Its dimensions of 90×50×3mm allow it to be used to fill the gap between a chip and a cooling surface.
Key features of the DLTECH thermal pad 90×50×3mm 15W/mK
- Designed for heat dissipation
- Thermal conductivity of 15W/mK
- Dimensions: 90×50×3mm (L×W×H)
Specifications
Thermal conductivity
Dimensions
| Code: | DLTech006 |
| Warranty: | 24 months |
| Manufacturer information |
Lukáš Drahozal, Vystrkov 118, [email protected], +420736762366 |