Silikonová pasta pod chladič

Product accessories
Silikonová pasta pod chladič
Teplovodivá pasta improving heat transfer between the processor and cooler, thereby reducing the temperature of the processor and thus extend its life and stability.Apply directly to the processor at the point where it abut the radiator.Pack contains 3 ml pastes that sufficient approximately 10 uses.
Note:to be applied in very thin layer and the only place to direct contact with the chip condenser.
Note:to be applied in very thin layer and the only place to direct contact with the chip condenser.
Whole description
| Code: | CA099 |
| Manufacturer information |
TechniSat Digital Sp. z o.o., ul. Poznańska 2, Siemianice, 55-120 Oborniki Śląskie, Poland, [email protected], +48 71 310 4000, www.technisat.com
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