DLTech Thermal Pad 90 × 50 × 0.75 mm 15 W/mK
189,-
DLTech Thermal Pad 90 × 50 × 0.75 mm 15 W/mK
The DLTECH Thermal Pad provides effective heat transfer between electronic components and heat sinks. It offers thermal conductivity of 15W/mK, ensuring reliable heat dissipation from processors, graphics cards or memory modules. The pad contains no metallic particles and is electrically non-conductive, eliminating the risk of short circuits if it comes into contact with other components. The material density is 3.38g/cm³.
Key features of the DLTECH thermal pad 90×50×0.75mm
- Designed for effective heat transfer between components and heat sinks
- Thermal conductivity of 15W/mK
- Contains no metallic particles
- Electrically non-conductive
- Material density of 3.38g/cm³
- Dimensions: 90×50×0.75mm
Whole description
Specifications
Specific Features
Features
No metallic particles, Electrically non-conductive
Thermal Conductivity
15 W/mK
Density
3.38 g/cm3
Thermal conductivity
Thermal Conductivity
15 W/mK
Dimensions
Length
90 mm
Width
50 mm
Height
0.75 mm
All parameters
| Code: | COMPaaa0272 |
| Warranty: | 24 months |
| Manufacturer information |
Lukáš Drahozal, Vystrkov 118, [email protected], +420736762366 |