DLTech Thermal Pad 90 × 50 × 1.25 mm 15 W/mK
279,-
DLTech Thermal Pad 90 × 50 × 1.25 mm 15 W/mK
The DLTECH Thermal Pad provides efficient heat transfer between electronic components and a heatsink. With a thermal conductivity of 15W/mK, it ensures rapid heat dissipation from processors, graphics cards, or memory modules. The pad contains no metallic particles and is electrically non-conductive, eliminating the risk of short circuits on sensitive components.
Key features of the DLTECH Thermal Pad
- Designed for heat dissipation from processors, graphics cards, and memory modules
- Thermal conductivity of 15W/mK
- Electrically non-conductive and contains no metallic particles
- Pad density of 3.38g/cm³
- Dimensions 90×50×1.25mm (L×W×H)
Whole description
Specifications
Specific Features
Features
No metallic particles, Electrically non-conductive
Thermal Conductivity
15 W/mK
Density
3.38 g/cm3
Thermal conductivity
Thermal Conductivity
15 W/mK
Dimensions
Length
90 mm
Width
50 mm
Height
1.25 mm
All parameters
| Code: | COMPaaa0271 |
| Warranty: | 24 months |
| Manufacturer information |
Lukáš Drahozal, Vystrkov 118, [email protected], +420736762366 |